Tech-BondTM
Molecular Bonding System
truly "Tool Box Worthy"
Blue and Black Bonding Agents
Tech-BondTM Blue (Standard Viscosity) and/or Tech-BondTM Black (Thick Viscosity) work with porous and non-porous materials, natural and man-made. A brief list of the materials that can be easily and quickly bonded includes: metals, wood, rubber, porcelain, china, fabric, paper, leather, etc.
NOTE: Both Bonding Agents are clear, dry clear and will not yellow with age.
Tech-BondTM GEL
Polyolefin Plastics
Our adhesion promoter, the Poly Prep, will enable the polyolefin family of plastics; polypropylene, polyethylene & poly-urethane ... quickly, to be bonded easily, quickly and with strength.
,,, AND our Poly Prep will allow you to bond UHMW's, Teflon(R), Delrin(R), nylon, ABS and silicon polymers.
Activator/Accelerator (A/A)
Tech-Bond's Activator/ Accelerator is designed to work with Tech-BondTM Bonding Agents. Use of the A/A will cause the Bonding Agent to set within seconds and for that bond to reach operational strength in minutes. Operational strength being defined as ninety percent of full strength. Use of the A/A is recommended with porous materials, plastics and/or when cross-bonding different materials. Please read the instructions that come with the Tech-BondTM System on using the A/A.
Debonder/Cleaner (D/C)
There are two ways to "clean" a Tech-BondTM join. The first way is to use Acetone, which can be easily purchased in hardware stores or as nail polish remover.
The better way to remove super-glue or our Bonding Agents is to use Tech-Bond's D/ C, which dissolves Tech-BondTM Bonding Agents (and super glues) on contact, usually without any damage to the underlying sub-strate.
Please test the Debonder/ Cleaner on the material(s) before using to make sure that the Debonder/ Cleaner does not cause damage to the material.
FILLER
Tech-Bond's Filler is a silica sand compound that can be used to fill cracks, gaps and holes. The FILLER also adds vital surface area and can be sanded and painted. Our FILLER is a critical component of a bonding solution system.